Author:
Favata Joseph,Shahbazmohamadi Sina
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference21 articles.
1. Development of a Fine Pitch Copper Wire Bond Process for Integrated Circuit Devices;Schindler,2008
2. Wire Bonding in Microelectronics;Harman,2010
3. Interconnect mechanisms in microelectronic packaging;Roma,2016
4. Reliability of wirebonds in micro-electronic packages;Zhang;Microelectron. Int.,2008
5. Comparative reliability studies and analysis of Au, Pd-coated Cu and Pd-doped Cu wire in microelectronics packaging;Chong Leong;PLoS One,2013
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