Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference7 articles.
1. Power distribution networks for system-on-package: status and challenges;Swaminathan;IEEE Trans. Adv. Packag.,2004
2. Reliability analysis of flip chip designs via computer simulation;Lu;J. Electron. Packag.,2000
3. Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules;Yang;IEEE Trans. Device Mater. Reliab.,2013
4. Fatigue model based on average cross-section strain of Cu trace cyclic bending;Farley,2011
5. Solid State Technology Association, JEP122H, Failure Mechanisms and Models for Semiconductor Devices;JEDEC,2016
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献