A numerical analysis on the effect of point-support methods on the fatigue performance of thermally cycled electronic assemblies-Reference-Cited by-同舟云学术

A numerical analysis on the effect of point-support methods on the fatigue performance of thermally cycled electronic assemblies

Published:2021-12 Issue: Volume:127 Page:114419
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Gharaibeh Mohammad A.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference29 articles.

1. Failures of electronic devices: solder joints failure modes, causes and detection methods;Gharaibeh,2020

2. Experimental and numerical fatigue life assessment of SAC305 solders subjected to combined temperature and harmonic vibration loadings;Gharaibeh,2020

3. Experimental and numerical investigations of the vibration reliability of BGA and LGA solder configurations and SAC105 and 63Sn37Pb solder alloys;Gharaibeh,2019

4. Under-filled BGA solder joint vibration fatigue damage;Wong,2002

5. Vibration testing and analysis of ball grid array package solder joints;Wong,2007

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