Physics of failure based lifetime modelling for sintered silver die attach in power electronics: Accelerated stress testing by isothermal bending and thermal shock in comparison-Reference-Cited by-同舟云学术

Physics of failure based lifetime modelling for sintered silver die attach in power electronics: Accelerated stress testing by isothermal bending and thermal shock in comparison

Published:2023-06 Issue: Volume:145 Page:114973
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Heilmann Jens^ORCID,Wunderle Bernhard,Zschenderlein Uwe,Wille Catharina,Pressel Klaus

Funder

European Commission

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference34 articles.

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3. Kupfersintern als fügetechnologie für leistungselektronik;Schwarzer,2022

4. Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests;Heilmann;Elsevier Microelectron. Reliab.,2017

5. Acceleration of lifetime modeling by isothermal bending fatigue tests;Heilmann,2015

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