Author:
Wang Lei,Wu Lu-Chao,Wang Jun
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference33 articles.
1. Controlled fracture and mode-mixity dependence of nanoscale interconnects;Li;IEEE T Device Mat Re,2017
2. Impact of packaging design on reliability of large die Cu/low-κ (BD) interconnect;Chai;Proc ECTC,2008
3. An effective and application-specific evaluation of low-k dielectric integration integrity using copper pillar shear testing;Ahari;Proc ECTC,2020
4. Screw dislocations around a radial surface crack in a circular bar;Lin;Mat Sci Eng A Struct,1994
5. Chip–package interaction and reliability improvement by structure optimization for ultralow-k interconnects in flip-chip packages;Zhang;IEEE T Device Mat Re,2012
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