Combined effect of Bi and Ni elements on the mechanical properties of low-Ag Cu/Sn-0.7Ag-0.5Cu/Cu solder joints-Reference-Cited by-同舟云学术

Combined effect of Bi and Ni elements on the mechanical properties of low-Ag Cu/Sn-0.7Ag-0.5Cu/Cu solder joints

Published:2020-04 Issue: Volume:107 Page:113618
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Kong Xiangxia,Zhai Junjun,Sun Fenglian,Liu Yang,Zhang Hao

Funder

National Natural Science Foundation of China

Natural Science Foundation of Hebei Province

Doctoral Research Fund of North China Institute of Aerospace Engineering

Science and Technology Research

Development Plan Project of Langfang City, China

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference37 articles.

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2. Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling;Li;Microelectron. Reliab.,2019

3. Failure mechanisms and crack propagation paths in thermally aged Pb-free solder interconnects;Monlevade;J. Electron. Mater.,2007

4. Effect of alternating current (AC) stressing on the microstructure and mechanical properties of low-silver content solder interconnect;Zhu;Microelectron. Reliab.,2019

5. The effects of additives to SnAgCu alloys on microstructure and drop impact reliability of solder joints;Liu;JOM,2007

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