Author:
Regard Charles,Gautier Christian,Fremont Hélène,Poirier Patrick,Xiaosong M.A.,Jansen Kaspar M.B.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference12 articles.
1. ITRS Executive Summary; 2007, ed.
2. Guo Y, Zhao J-H. A practical die stress model and its application in flip-chip packages. In: International society conference on thermal phenomena; 2000.
3. Silicon based system in package: improvement of passive integration process to avoid TBMS failure;Gautier;Microelectron Reliab,2008
4. Regard C, Gautier C, Frémont H, Poirier P. Influence of underfill methods on the solder joint fatigue of wafer level packaging. In: ICEPT-HDP 2008.
5. Murray F. Silicon based system-in-package: a passive integration technology combined with advanced packaging and system based design tools to allow a breakthrough in miniaturization. In: Proc. BCTM; 2005.
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