Author:
Herms M.,Wagner M.,De Wolf I.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference7 articles.
1. Failure and Stress Analysis of Cu TSV using GHz-Scanning Acoustic Microscopy and Scanning Infrared Polariscopy;De Wolf,2015
2. Photoelastic Characterization of Residual Stress in GaAs-wafers;Geiler;Mater. Sci. Semicond. Process.,2006
3. Introduction to Dislocations;Hull,1984
4. Photoelastic Imaging of Process Induced Defects in 300mm Silicon Wafers;Geiler;Mat. Res. Soc. Symp. Proc.,2000
5. Impact of Through Silicon Via Induced Mechanical Stress on Fully Depleted Bulk FinFET Technology;Guo,2012
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