Author:
Shirley Dwayne R.,Ghorbani Hamid R.,Spelt Jan K.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference35 articles.
1. Thermomechanical analysis of solder joints under thermal and vibrational loading;Basaran;J Electron Pack, Trans ASME,2002
2. Creep and relaxation of nonlinear viscoelastic materials;Findley,1976
3. Constitutive relation and creep–fatigue life model for eutectic tin–lead solder;Knecht;IEEE Trans Component Hybrids Manuf Technol,1990
4. Ridout S, Bailey C. Review of methods to predict solder joint reliability under thermo-mechanical cycling. Fatigue Fract Eng Mater Struct, doi:10.1111/j.1460-2695.2006.01065.x; 2006. p. 1–13.
5. Clech JP. An extension of the omega method to primary and tertiary creep of lead-free solders. In: Presented at 55th electronic components and technology conference 2005; 2005.
Cited by
27 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献