The effects of rheological and wetting properties on underfill filler settling and flow voids in flip chip packages-Reference-Cited by-同舟云学术

The effects of rheological and wetting properties on underfill filler settling and flow voids in flip chip packages

Published:2007-12 Issue:12 Volume:47 Page:1958-1966
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Wang Jinlin

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference21 articles.

1. Underfill flow as viscous flow between parallel plates driven by capillary action;Schwiebert;IEEE Trans Compon Pack Manufact Technol Part C,1996

2. A study of underfill dispensing process;Chia;Int J Microcircuits Electron Pack,1999

3. Underflow process for direct-chip-attachment packaging;Lehmann;IEEE Trans Compon Pack Manufact Technol Part A,1998

4. The dynamic of capillary flow;Washburn;Phys Rev,1921

5. The kinetics of wetting of surfaces by polymers; capillary flow;Newman;J Colloid Interf Sci,1968

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