Author:
Nousiainen O.,Lehtiniemi L.,Kangasvieri T.,Rautioaho R.,Vähäkangas J.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference19 articles.
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5. Lehtiniemi L, Nousiainen O, Kangasvieri T, Vähäkangas J. Reliability of lead-free single-melt solder joints in LTCC/PWB assemblies. In: Proceedings of new exploratory technologies 2006 conference (NEXT), Salo, Finland; 2006. p. 63–7.
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