Metallurgical reactions in composite 90Pb10Sn/lead-free solder joints and their effect on reliability of LTCC/PWB assembly-Reference-Cited by-同舟云学术

Metallurgical reactions in composite 90Pb10Sn/lead-free solder joints and their effect on reliability of LTCC/PWB assembly

Published:2006-10 Issue:10 Volume:35 Page:1857-1865
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Nousiainen O.,Putaala J.,Kangasvieri T.,Rautioaho R.,Vähäkangas J.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-006-0168-z.pdf

Reference23 articles.

1. N. Okinaga, H. Kuroda, and Y. Nagai, Proc. 51st Electronic Components and Technology Conf. (Piscataway, NJ: IEEE, 2001), pp. 1345–1349.

2. O. Nousiainen, R. Rautioaho, K. Kautio, J. Jääskeläinen, and S. Leppävuori, Soldering Surf. Mount Technol. 17, 32 (2005).

3. T. Kangasvieri, O. Nousiainen, J. Putaala, R. Rautioaho, and J. Vähäkangas, Microelectron. Reliab. 46, 1335 (2006).

4. M. Pecht, Y. Fukuda, and S. Rajagopal, IEEE Trans. Compon. Electron. Packag. Manuf. 27, 221 (2004).

5. Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. Hyperlink: http://europa.eu.int/eur-lex/lex/LexUriServ/LexUriServ.do?uri=OJ:L:2003:037:0019:0023:EN:PDF

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