Failure analysis and improvement research on high lead solder bump of flip chip FPGA for aerospace
Author:
Affiliation:
1. China Aerospace Components Engineering Center,China Academy of Space Technology,Beijing,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873406.pdf?arnumber=9873406
Reference16 articles.
1. Au−Ni−Sn intermetallic phase relationships in eutectic Pb−Sn solder formed on Ni/Au metallization
2. Growth and Ripening of (Au,Ni)Sn4 Phase in Pb-Free and Pb-Containing Solders on Ni/Au Metallization
3. Metallurgical reactions in composite 90Pb10Sn/lead-free solder joints and their effect on reliability of LTCC/PWB assembly
4. Investigations of Au-Sn alloys on different end-metallizations for high temperature applications [solders]
5. A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates
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