Author:
Chen Cheng,Hou Fengze,Liu Fengman,She Qian,Cao Liqiang,Wan Lixi
Funder
National Natural Science Foundation of China
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference39 articles.
1. The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade;Tummala;IEEE Transactions on Advanced Packaging 27.2,2004
2. RF-system-on-package (SOP) for wireless communications;Lim;IEEE Microwave magazine 3.1,2002
3. LTCC substrates for RF/MW application;Yang;RF and Microwave Microelectronics Packaging. Springer US,2010
4. A fully SiP integrated V-band Butler matrix end-fire beam-switching transmitter using flip-chip assembled CMOS chips on LTCC;Kuo;IEEE Transactions on Microwave Theory and Techniques 60.5,2012
Cited by
16 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献