Investigation of relation between intermetallic and tin whisker growths under ambient condition

Author:

Kim K.S.,Yu C.H.,Han S.W.,Yang K.C.,Kim J.H.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference25 articles.

1. Lead-free solder interconnect reliability;Shangguan,2005

2. Driving force for the formation of Sn whiskers: compressive stress-pathways for its generation and remedies for its elimination and minimization;Xu;IEEE Trans Elect Packag Manuf,2005

3. Su P, Ding M, Chopin S. Effects of reflow on the microstructure and whisker growth propensity of Sn finish. In: Proceedings of the 55th electronic components and technology conference, Florida, May 2005. p. 434–40.

4. Ding M, Su P, Chopin S. Effects of trim and form on the microstructure and whisker growth propensity of Sn finish. In: Proceedings of the 55th electronic components and technology conference, Florida, May 2005. p. 452–6.

5. Tin whisker studied by focused ion beam imaging and transmission electron microscopy;Sheng;J Appl Phys,2002

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