Reliability investigations on LIFT-printed isotropic conductive adhesive joints for system-in-foil applications

Author:

Sridhar Ashok,Perinchery Sandeep M.,Smits Edsger C.P.,Mandamparambil Rajesh,van den Brand Jeroen

Funder

EU Marie Curie ITN FlexSmell

FP7

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference16 articles.

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1. Laser-Induced Forward Transfer (LIFT) Technique as an Alternative for Assembly and Packaging of Electronic Components;IEEE Journal of Selected Topics in Quantum Electronics;2021-11

2. Loading rate response on shear mechanical properties of conductive adhesive with different silver contents;Journal of Adhesion Science and Technology;2020-04-08

3. Laser‐Induced Forward Transfer: Fundamentals and Applications;Advanced Materials Technologies;2018-08-08

4. Laser Printing of Electronic Materials;Laser Printing of Functional Materials;2018-01-05

5. Recent Developments on Epoxy-Based Thermally Conductive Adhesives (TCA): A Review;Polymer-Plastics Technology and Engineering;2017-09-18

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