Recent Developments on Epoxy-Based Thermally Conductive Adhesives (TCA): A Review-Reference-Cited by-同舟云学术

Recent Developments on Epoxy-Based Thermally Conductive Adhesives (TCA): A Review

Published:2017-09-18 Issue:9 Volume:57 Page:903-934
ISSN:0360-2559
Container-title:Polymer-Plastics Technology and Engineering
language:en
Short-container-title:Polymer-Plastics Technology and Engineering

Author:

Singh Amit Kumar¹²,Panda Bishnu Prasad¹,Mohanty Smita¹²,Nayak Sanjay Kumar¹²,Gupta Manoj Kumar³

Affiliation:

1. Laboratory for Advanced Research in Polymeric Materials (LARPM), Central Institute of Plastics Engineering and Technology (CIPET), Bhubaneswar, Odisha, India

2. Central Institute of Plastics Engineering and Technology (CIPET), Chennai, Tamil Nadu, India

3. Institute for Plasma Research, Gandhinagar, Gujarat, India

Funder

Board of Research in Nuclear Sciences

Publisher

Informa UK Limited

Subject

Materials Chemistry,Polymers and Plastics,General Chemical Engineering,Materials Science (miscellaneous)

Link

https://www.tandfonline.com/doi/pdf/10.1080/03602559.2017.1354253

Reference169 articles.

1. Advanced adhesives in electronics

2. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

3. Thermal properties of epoxy resin based thermal interfacial materials by filling Ag nanoparticle-decorated graphene nanosheets

4. Influence of electrolessly silver-plated multi-walled carbon nanotubes on thermal conductivity of epoxy matrix nanocomposites

5. Electrostatically Dissipative Polystyrene Nanocomposites containing Copper Nanowires

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