Time-domain viscoelastic constitutive model based on concurrent fitting of frequency-domain characteristics

Author:

Chiu Tz-Cheng,Lee Bo-Sheng,Huang Dong-Yi,Yang Yu-Ting,Tseng Yi-Hsiu

Funder

National Science Council of ROC

ASE Group

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference14 articles.

1. PoP/CSP warpage evaluation and viscoelastic modeling;Lin,2008

2. Effects of curing and chemical aging on warpage — characterization and simulation;Chiu;IEEE Trans. Device Mater. Reliab.,2011

3. Determination of visco-elastic properties during the curing process of underfill materials;Ernst,2000

4. Characterization of the viscoelastic properties of an epoxy molding compound during cure;Sadeghinia;Microelectron. Reliab.,2012

5. Methods of interconversion between linear viscoelastic material functions. Part II—an approximate analytical method;Schapery;Int. J. Solids Struct.,1999

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2. A Viscoplastic-Based Fatigue Reliability Model for the Polyimide Dielectric Thin Film;2019 IEEE 69th Electronic Components and Technology Conference (ECTC);2019-05

3. Physical Aging of Epoxy Molding Compound and Its Influences on the Warpage of Reconstituted Wafer;2018 IEEE 68th Electronic Components and Technology Conference (ECTC);2018-05

4. Warpage simulation for the reconstituted wafer used in fan-out wafer level packaging;Microelectronics Reliability;2018-01

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