Online test method of FPGA solder joint resistance with low power consumption-Reference-Cited by-同舟云学术

Online test method of FPGA solder joint resistance with low power consumption

Published:2015-08 Issue:9-10 Volume:55 Page:1867-1871
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Wang Nantian,Li Yue,Yu Zongyue,Ren Zhiqian

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference13 articles.

1. Real-time detection of solder-joint faults in operational field programmable gate arrays;Hofmeister,2007

2. Random vibration reliability of BGA lead-free solder joint;Liu;Microelectron Reliab,2014

3. Evaluating board level solder interconnects reliability using vibration test methods;Liu;Microelectron Reliab,2014

4. Thermal-aware reliability analysis for platform FPGAs;Mangalagiri,2008

5. Fatigue life prediction of solder joints with consideration of frequency, temperature and cracking energy density;Lee;Int J Fatigue,2014

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1. Study on Establishing Degradation Model of Chip Solder Joint Material under Coupled Stress;Materials;2020-04-12

2. A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature;IEEE Access;2020

3. Failure and failure characterization of QFP package interconnect structure under random vibration condition;Microelectronics Reliability;2018-12

4. Design Method of Build-in Test Equipment Interface in FPGA System Based on JTAG;IOP Conference Series: Materials Science and Engineering;2018-11-05

5. A Low Power Online Test Method for FPGA Single Solder Joint Resistance;Journal of Electronic Testing;2017-12