Evaluating board level solder interconnects reliability using vibration test methods

Author:

Liu Y.,Sun F.L.,Zhang H.W.,Wang J.,Zhou Z.

Funder

Natural Science Foundation of China, NSFC

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference9 articles.

1. The effects of concurrent power and vibration loads on the reliability of board-level interconnections in power electronic assemblies;Karppinen;IEEE Trans Dev Mater Reliab,2013

2. Harmonic and random vibration durability of SAC305 and Sn37Pb solder alloys;Zhou;IEEE Trans Compon Pack Technol,2010

3. Mattila TT, Suotula L, Kivilahti JK. Ieee, replacement of the drop test with the vibration test – the effect of test temperature on reliability. In: 58th Electronic components and technology conference, proceedings; 2008. p. 629–37.

4. Marjamaki P, Mattila TT, Kivilahti JK. Ieee, a comparative study of the failure mechanisms encountered in drop and large amplitude vibration tests. In: 56th Electronic components and technology conference 2006, vols. 1 and 2, Proceedings; 2006. p. 95–101.

5. Random vibration reliability of BGA lead-free solder joint;Liu;Microelectron Reliab,2014

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4. Random vibration analysis of 3-Arc-Fan compliant interconnects;Microelectronics Reliability;2018-02

5. A Low Power Online Test Method for FPGA Single Solder Joint Resistance;Journal of Electronic Testing;2017-12

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