Author:
Chung Philip Y.,Sitaraman Suresh K.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference42 articles.
1. Studies on a novel flip-chip interconnect structure. Pillar bump;Wang,2001
2. K. Saitoh and R. Shoji, "Bump structure, bump forming method and package connecting body," ed: Google Patents, 2001.
3. Bed of nails – 100microns pitch wafer level interconnections process;Vempati Srinivasa,2004
4. Fatigue and bridging study of high-aspect-ratio multicopper-column flip-chip interconnects through solder joint shape modeling;Liao;IEEE Trans. Compon. Packag. Technol.,2006
5. Electroplated copper nanowires as thermal interface materials;Chow,2016
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