Improving the reliability of ball grid arrays under random vibration by optimization of module design-Reference-Cited by-同舟云学术

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Improving the reliability of ball grid arrays under random vibration by optimization of module design

Published:2018-11-05 Issue:20 Volume:27 Page:1748-1755
ISSN:1537-6494
Container-title:Mechanics of Advanced Materials and Structures
language:en
Short-container-title:Mechanics of Advanced Materials and Structures

Author:

Kokabi Alireza¹^ORCID,Samavatian Majid²,Hojati-Najafabadi Reza³,Ilyashenko Lubov K.⁴,Samavatian Vahid⁵

Affiliation:

1. Department of Electrical Engineering, Hamedan University of Technology, Hamedan, Iran;

2. Young Researchers and Elites Club, Science and Research Branch, Islamic Azad University, Tehran, Iran;

3. Faculty of Mechanical Engineering, Shahid Rajaee Teacher Training University, Tehran, Iran;

4. Tyumen Industrial University, Tyumen, Russia;

5. Young Researchers and Elite Club, South Tehran Branch, Islamic Azad University, Tehran, Iran

Publisher

Informa UK Limited

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science,General Mathematics,Civil and Structural Engineering

Link

https://www.tandfonline.com/doi/pdf/10.1080/15376494.2018.1525626

Reference20 articles.

1. Evaluation of the characteristics of 305SAC lead-free solder joints between a chip electrode and a Cu-pad in automotive electronics

2. Fatigue failure of pb-free electronic packages under random vibration loads

4. Reliability study of package-on-package stacking assembly under vibration loading

5. Effect of solder layer thickness on thermo-mechanical reliability of a power electronic system

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1. Investigation of dynamic characteristics and fatigue life prediction of Pb free solder material under random vibration;Materials Research Express;2024-08-01

2. Anti-reflective MX (M = Sc and Y; X = N, P, As, Sb and Bi) monolayers: structural, electronic and optical study;Semiconductor Science and Technology;2023-12-04

3. Enhancing ball grid array (BGA) component design and reliability using a novel reliability-based design optimization (RBDO) methodology;Mechanics of Advanced Materials and Structures;2023-07-31

4. Transfer learning prediction of spin–orbit correction from bond polarizability for electronic properties of group-III monochalcogenides monolayers;Physica E: Low-dimensional Systems and Nanostructures;2023-01

5. Application of deep neural network in fatigue lifetime estimation of solder joint in electronic devices under vibration loading;Welding in the World;2022-07-18

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