Fatigue failure of pb-free electronic packages under random vibration loads
Author:
Affiliation:
1. Department of Production Engineering, PSG College of Technology, Coimbatore, Tamilnadu, India
Publisher
Informa UK Limited
Subject
Computational Mathematics,Computational Mechanics
Link
https://www.tandfonline.com/doi/pdf/10.1080/15502287.2018.1430074
Reference21 articles.
1. D. S. Steinberg, “Vibration analysis for electronic equipment,” John Wiley & Son, New York, 2000
2. Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb–Sn solder
3. Vibration reliability characterization of PBGA assemblies
4. Combining vibration test with finite element analysis for the fatigue life estimation of PBGA components
5. Finite element model verification for packaged printed circuit board by experimental modal analysis
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