Funder
České Vysoké Učení Technické v Praze
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference18 articles.
1. Qualification Tests for Components and Assemblies;Birolini,1999
2. Optimisation of lead free solders reflow profile;Pietrikova,2006
3. The properties comparison of solder joints on ceramic and FR-4 substrates;Adamek,2012
4. Thermal aging effects on the thermal cycling reliability of lead-free fine pitch packages;Zhang;IEEE Trans. Compon. Packag. Manuf. Technol.,2013
5. Residues in printed wiring boards and assemblies;Douglas;Circuit World,2001
Cited by
18 articles.
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