Improved inductive-system-level IEC ESD performance for automotive applications using mutual ballasted ESD protection technique-Reference-Cited by-同舟云学术

Improved inductive-system-level IEC ESD performance for automotive applications using mutual ballasted ESD protection technique

Published:2016-02 Issue: Volume:57 Page:47-52
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Salman Akram A.,Farbiz Farzan^ORCID,Concannon Ann,Edwards Hal,Boselli Gianluca

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference9 articles.

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3. Hardware Requirements for LIN, CAN and FlexRay Interfaces in Automotive Applications,2012

4. The relevance of long-duration TLP stress on system level ESD design;Boselli,2010

5. Correlation between system level and TLP tests applied to stand-alone ESD protections and commercial products;Besse,2010

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