System-Level ESD Protection for Automotive Electronics by Co-Design of TVS and CAN Transceiver Chips-Reference-Cited by-同舟云学术

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System-Level ESD Protection for Automotive Electronics by Co-Design of TVS and CAN Transceiver Chips

Published:2017-09 Issue:3 Volume:17 Page:570-576
ISSN:1530-4388
Container-title:IEEE Transactions on Device and Materials Reliability
language:
Short-container-title:IEEE Trans. Device Mater. Relib.

Author:

Chuang Che-Hao,Ker Ming-Dou^ORCID

Funder

Ministry of Science and Technology (MOST), Taiwan

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/7298/8024083/08006249.pdf?arnumber=8006249

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Complementary HV Dual Direction SCR Design Strategy;2023 45th Annual EOS/ESD Symposium (EOS/ESD);2023-10-02

2. IEC ESD Co-Design Methodology for On-Chip Protection at High Voltage Fault Tolerant Transceivers;2023 45th Annual EOS/ESD Symposium (EOS/ESD);2023-10-02

3. System-Level ESD-Induced Voltage Fluctuation to the Power of Integrated Circuits on System Board;IEEE Transactions on Electromagnetic Compatibility;2022-12

4. A high-Speed CAN Bus Transmitter with Low Electromagnetic Emission;2022 7th International Conference on Integrated Circuits and Microsystems (ICICM);2022-10-28

5. Predicting the impact of transient voltage suppressor used for ESD protection on the low noise amplifier;Microelectronics Journal;2021-07

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