Effect of elevated temperature on PCB responses and solder interconnect reliability under vibration loading-Reference-Cited by-同舟云学术

Effect of elevated temperature on PCB responses and solder interconnect reliability under vibration loading

Published:2015-11 Issue:11 Volume:55 Page:2391-2395
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Zhang H.W.,Liu Y.,Wang J.,Sun F.L.

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference20 articles.

1. Thermal cycling reliability of Sn–Ag–Cu solder interconnections—part 2: failure mechanisms;Hokka;J. Electron. Mater.,2013

2. Thermal cycling reliability of Sn–Ag–Cu solder interconnections. Part 1: effects of test parameters;Hokka;J. Electron. Mater.,2013

3. Life time prediction for lead-free solder joints under vibration loads;Meier,2011

4. A comparative study of the failure mechanisms encountered in drop and large amplitude vibration tests;Marjamaki,2006

5. Harmonic and random vibration durability of SAC305 and Sn37Pb solder alloys;Zhou;IEEE Trans. Compon. Packag. Technol.,2010

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