Effect of temperature on vibration durability of lead-free solder joints-Reference-Cited by-同舟云学术

Effect of temperature on vibration durability of lead-free solder joints

Published:2022-12 Issue: Volume:139 Page:114824
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Höhne Robert,Meier Karsten,Dasgupta Abhijit,Leslie David,Ochmann Maximilian,Bock Karlheinz

Funder

University of Maryland

Technische Universität Dresden

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference31 articles.

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3. An incremental damage superposition approach for reliability of electronic interconnects under combined accelerated stresses;Upadhyayula;ASME Int. Mech. Eng. Congr. Expo.,1997

4. Modeling of combined temperature cycling and vibration loading on PBGA solder joints using an incremental damage superposition approach;Qi;IEEE Trans. Adv. Packag.,2008

5. A mechanistic model of damage evolution in lead free solder joints under combinations of vibration and thermal cycling with varying amplitudes;Borgesen;Microelectron. Reliab.,2019

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