Understanding board level vibrations in automotive electronic modules-Reference-Cited by-同舟云学术

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Understanding board level vibrations in automotive electronic modules

Published:2024-08 Issue: Volume:159 Page:115430
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Thukral V.,Roucou R.,Chou C.,Zaal J.J.M.,van Soestbergen M.,Rongen R.T.H.,van Driel W.D.,Zhang G.Q.

Funder

NXP Semiconductors NV

Delft University of Technology

Publisher

Elsevier BV

Reference32 articles.

1. Designing for 1st and 2nd level reliability of micro-electronic packages using combined experimental - numerical techniques;van Silfhout,2006

2. Automotive radar sensor for ultra short range applications;Jansen,2017

3. Effect of Environmental and Testing Conditions on Board Level Vibration;Roucou,2016

4. Vibration Analysis for Electronic Equipment, John Wiley and Sons;Steinberg,2000

5. "Road Test and Reliability Analysis of Automotive Electronic Modules," in IEEE 67th Electronic Components and Technology Conference;Xie,2017

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