Author:
Bahrebar Sajjad,Homayoun Sajad,Ambat Rajan
Subject
General Materials Science,General Chemical Engineering,General Chemistry
Reference103 articles.
1. Climate-Protective Packaging: Using Basic Physics to Solve Climatic Challenges for Electronics in Demanding Applications;Jacobsen;IEEE Ind. Electron. Mag.,2014
2. A system engineering approach using FMEA and bayesian network for risk analysis-a case study;Rastayesh;Sustain,2020
3. Water film formation on the PCBA surface and failure occurrence in electronics;Piotrowska,2018
4. Investigation of critical factors effect to predict leakage current and time to failure due to ECM on PCB under humidity;Bahrebar;Microelectron. Reliab.,2021
5. Failure Analysis: A Practical Guide for Manufacturers of Electronic Components and Systems;Bâzu,2011
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3 articles.
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