Author:
Ding Y.,Lofrano M.,Varela Pedreira O.,Zahedmanesh H.,Croes K.,De Wolf I.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
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1. Challenges for Interconnect Reliability;Proceedings of the 2023 International Symposium on Physical Design;2023-03-26
2. Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters;2023 IEEE International Reliability Physics Symposium (IRPS);2023-03