Author:
Zahedmanesh Houman,Croes Kristof
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference23 articles.
1. Electromigration and thermomigration behavior of flip chip solder joints in high current density packages;Yang;J. Mater. Res.,2008
2. Mass transport phenomena in copper nanowires at high current density;Huang;Nano Res.,2016
3. Thin-copper-metal interconnection thermomigration analysis in ESD regime;Di Biccari;IEEE Trans. Device Mater. Reliab.,2015
4. Temperature gradient impact on electromigration failure in VLSI metallization;Weiling,1998
5. Effect of thermal gradients on the electromigration lifetime in power electronics;Nguyen,2004
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