Challenges for Interconnect Reliability-Reference-Cited by-同舟云学术

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Challenges for Interconnect Reliability

Published:2023-03-26 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the 2023 International Symposium on Physical Design
language:
Short-container-title:

Author:

Varela Pedreira Olalla¹^ORCID,Zahedmanesh Houman¹^ORCID,Ding Youqi²^ORCID,Ciofi Ivan¹^ORCID,Croes Kristof¹^ORCID

Affiliation:

1. imec, Leuven, Belgium

2. KU Leuven and imec, Leuven, Belgium

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/3569052.3578909

Reference3 articles.

1. A combined modelling approach to design test structures to study thermomigration in Cu interconnects

2. H. Zahedmanesh , 2021 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP) , pp. 1 -- 7 . H. Zahedmanesh et al., 2021 ACM/IEEE International Workshop on System Level Interconnect Prediction (SLIP), pp. 1--7.

3. H. Zahedmanesh , IEEE International Reliability Physics Symposium (IRPS) , 2022 , 2C.2 H. Zahedmanesh et al., IEEE International Reliability Physics Symposium (IRPS), 2022, 2C.2

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