Author:
Azoui T.,Tounsi P.,Dupuy Ph.,Guillot L.,Dorkel J.M.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference5 articles.
1. R. Amro, J. Lutz, J. Rudzki, R. Sittig, M. Thoben, Power cycling at high temperature swings of modules with low temperature joining technique, in: Proc. ISPSD, 2006.
2. Freescale data sheet MC10XS3435. .
3. Experimental behavior of single-chip IGBT and COOLMOS devices under repetitive short-circuit conditions;Lefebvre;IEEE Transactions on Electron Devices,2005
4. Characterization of alterations on power MOSFET devices under extreme electro-thermal fatigue;Martineau;Microelectronics Reliability,2010
5. Ab initio determination of electrical and thermal conductivity of liquid aluminum;Crocombette;Physical Review B,2005
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