Optimization for simulation of WL-CSP subjected to drop-test with plasticity behavior

Author:

Le Coq Cédric,Tougui Adellah,Stempin Marie-Pascale,Barreau Laurent

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference29 articles.

1. Pasi Nummila et al. Mechanical shock robustness of different WL-CSP types. Nokia Corporation – 2008 Electronic Components and Technology Conference.

2. Marjamäki P, et al. A comparative study of the failure mechanisms encountered in drop and large amplitude vibration tests. In: Electronic components and technology conference; 2006.

3. Effects of different drop test conditions on board-level reliability of chip-scale packages;Lai;J Microelectron Reliab,2008

4. Luan J-E, et al. A novel methodology for virtual qualification of IC packages under board level drop-test. In: Electronic components and technology conference; 2008.

5. Zhou J. Analytical analysis on the effect of time duration of acceleration pulse to a JEDEC board in drop-test. In: International conference on electronics packaging technology & high density packaging (ICEPT-HDP); 2008.

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