Author:
Lai Yi-Shao,Yang Po-Chuan,Yeh Chang-Lin
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference21 articles.
1. Wong EH, Rajoo R, Mai YW, Seah SKW, Tsai KT, Yap LM. Drop impact: fundamentals and impact characterisation of solder joints. In: Proceedings of the fifty-fifth electronic components and technology conference, Lake Buena Vista, FL; 2005. p. 1202–9.
2. Evaluation of solder joint strengths under ball impact test;Lai;Microelectron Reliab,2007
3. JEDEC Solid State Technology Association, JESD22-B110: subassembly mechanical shock, 2001.
4. JEDEC Solid State Technology Association, JESD22-B111: board level drop test method of component for handheld electronics products, 2003.
5. Board level drop impact – fundamental and parametric analysis;Wong;J Electron Packaging, ASME,2005
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