Multiscale analysis of multilayer printed circuit board using mechanics of structure genome
Author:
Affiliation:
1. School of Aeronautics and Astronautics, Purdue University, West Lafayette, Indiana, USA;
2. Department of Systems Innovation, School of Engineering, The University of Tokyo, Tokyo, Japan
Publisher
Informa UK Limited
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science,General Mathematics,Civil and Structural Engineering
Link
https://www.tandfonline.com/doi/pdf/10.1080/15376494.2019.1596335
Reference25 articles.
1. Determination of the orthotropic material properties of individual layers of printed circuit boards
2. JESD22-B111A, Board level drop test method of components for handheld electronic products, JEDEC Standard (2016).
3. Optimization for simulation of WL-CSP subjected to drop-test with plasticity behavior
4. Three-dimensional viscoelastic simulation of woven composite substrates for multilayer circuit boards
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