Author:
Lim Meng Keong,Lin Jingyuan,Ee Yong Chiang,Ng Chee Mang,Wei Jun,Gan Chee Lip
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference11 articles.
1. Maiz JA. In: Proc 27th Ann Rel Phys Symp. 1989. p. 220–8.
2. Suehle JS, Schafft HA. In: Proc 27th Ann Rel Phys Symp. 1989. p. 229–33.
3. Pierce DG, Snyder ES, Swanson Scot E, Irwin LW. In: 32nd Ann Rel Phys Symp. 1994. p. 198–206
4. Electromigration failure of integrated circuit metallizations subjected to high-frequency pulsed currents
5. A model for conductor failure considering diffusion concurrently with electromigration resulting in a current exponent of 2
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