Author:
Chiu Tz-Cheng,Huang Hong-Wei,Lai Yi-Shao
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference20 articles.
1. Chong SC, Khong CH, Sing KLC, Wee DHS, Liang CTW, Sheng VLW, et al. Process challenges and development of eWLP. In: Proceedings of the 12th electronics packaging technology conference; 2010. p. 527–31.
2. Warpage analysis of flip-chip PBGA packages subject to thermal loading;Tsai;IEEE Trans Device Mater Reliab,2009
3. Warpage analysis of epoxy molded packages using viscoelastic based model;Srikanth;J Mater Sci,2006
4. An integrated process modeling methodology and module for sequential multilayered substrate fabrication using a coupled cure-thermal-stress analysis approach;Dunne;IEEE Trans Electron Packag Manuf,2002
5. Yang DG, Jansen KMB, Ernst LJ, Zhang GQ, van Driel WD, Bressers HJL. Modeling of cure-induced warpage of plastic IC packages. In: Proceedings of the 5th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems; 2004. p. 33–40.
Cited by
11 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献