Synchrotron radiation real-time in situ study on dissolution and precipitation of Ag3Sn plates in sub-50μm Sn–Ag–Cu solder bumps
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference26 articles.
1. Enhancement of creep resistance and thermal behavior of eutectic Sn–Cu lead-free solder alloy by Ag and In-additions
2. Electromigration Damage Characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce Solder Joints by Three-Dimensional X-ray Tomography and Scanning Electron Microscopy
3. Elimination of voids in reactions between Ni and Sn: A novel effect of silver
4. Effects of Ag on the Kirkendall void formation of Sn–xAg/Cu solder joints
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1. Recent Progress in Metallurgical Bonding Mechanisms at the Liquid/Solid Interface of Dissimilar Metals Investigated via in situ X-ray Imaging Technologies;Acta Metallurgica Sinica (English Letters);2021-01-27
2. In Situ Observation of Electromigration-Induced Anomalous Precipitation of Ag3Sn Phase in Ag-Containing Solder Joints;Journal of Electronic Materials;2021-01-20
3. Effects of cooling rate and joint size on Sn grain features in Cu/Sn–3.5Ag/Cu solder joints;Materialia;2020-12
4. Heterogenous Bump Metallurgy Through a Sequential Plating Based Process;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06
5. A Study of Low-Cost Sequential Electroplating Bumping Process and its Metallurgical Behavior;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-05
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