Effects of cooling rate and joint size on Sn grain features in Cu/Sn–3.5Ag/Cu solder joints
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
General Materials Science
Reference24 articles.
1. Comprehensive comparative analysis of microstructure of Sn-Ag-Cu (SAC) solder joints by traditional reflow and thermo-compression bonding (TCB) processes;Hah;Materialia,2019
2. Nucleation and growth of tin in Pb-free solder joints;Gourlay;JOM,2015
3. Harnessing heterogeneous nucleation to control tin orientations in electronic interconnections;Ma;Nat. Commun.,2017
4. Role of diffusion anisotropy in β-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chip bumps undergoing electromigration;Huang;Acta. Mater.,2015
5. Formation of highly preferred orientation of β-Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature gradient effect;Zhao;Appl. Phys. Lett.,2017
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1. Investigation of Sn grain growth in solder joints by numerical simulations;2024 47th International Spring Seminar on Electronics Technology (ISSE);2024-05-15
2. Microstructures and mechanical properties of ENIG/Sn-3.5Ag/ENIG joints formed by ultrasonic-assisted solder bonding;Journal of Materials Research and Technology;2023-05
3. Characteristics of Cracking Failure in Microbump Joints for 3D Chip-on-Chip Interconnections under Drop Impact;Micromachines;2022-02-10
4. Influence of phase inhomogeneity on the mechanical behavior of microscale Cu/Sn–58Bi/Cu solder joints;Journal of Materials Science: Materials in Electronics;2021-11-05
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