Interfacial reactions in molten state micro solder joints under current stressing-Reference-Cited by-同舟云学术

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Interfacial reactions in molten state micro solder joints under current stressing

Published:2018-03 Issue: Volume:739 Page:388-392
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Li Xuemei,Sun Fenglian,Zhang Hao,Liu Meng,Fan Rui

Funder

National Natural Science Foundation of China

Young Foundation of Heilongjiang department of education

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference22 articles.

1. Effects of direct current on the wetting behavior and interfacial morphology between molten Sn and Cu substrate

2. Reverse polarity effect and cross-solder interaction in Cu/Sn–9Zn/Ni interconnect during liquid–solid electromigration

3. Effect of Cobalt Doping on the Microstructure and Tensile Properties of Lead Free Solder Joint Subjected to Electromigration

4. Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Ag content on microstructure and mechanical properties of Sn−xAg−0.5Cu solder joints under rapid thermal shock;Transactions of Nonferrous Metals Society of China;2024-06

2. Polarity effect of interfacial intermetallic compounds of BGA structure Cu/Sn–52In/Cu solder joints during electromigration;Intermetallics;2024-05

3. Study of the shear strength behavior in flip chip under thermo-mechano-electrical coupling and different solder height;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

4. The microstructure evolution and failure mechanism of Sn37Pb solder joints under the coupling effects of extreme temperature variation and electromigration;Materials Today Communications;2023-08

5. Growth mechanisms of intermetallic compounds and Bi-rich layer in ball grid array structure Cu/Sn-58Bi/Cu solder joints during solid–solid and liquid–solid electromigration;Journal of Materials Science: Materials in Electronics;2022-04-01

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