Electromigration-induced growth mode transition of anodic Cu6Sn5 grains in Cu|SnAg3.0Cu0.5|Cu lap-type interconnects-Reference-Cited by-同舟云学术

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Electromigration-induced growth mode transition of anodic Cu6Sn5 grains in Cu|SnAg3.0Cu0.5|Cu lap-type interconnects

Published:2017-05 Issue: Volume:703 Page:1-9
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Zhang Zhihao,Cao Huijun,Xiao Yong,Cao Yong,Li Mingyu,Yu Yuxi

Funder

National Nature Science Foundation of China

Fujian Province

Young Research Talent Training Program of Fujian Province

Technology Project of Education Department of Fujian Province

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference23 articles.

1. The chips are down for Moore's law;Waldrop;Nature,2016

2. In situ synchrotron study of electromigration induced grain rotations in Sn solder joints;Shen;Sci. Rep.,2016

3. An analytical method to predict electromigration-induced finger-shaped void growth in SnAgCu solder interconnect;Yao;Scr. Mater.,2015

4. Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling;Chang;Acta Mater.,2016

5. Cathodic peeling damage of Cu6Sn5 phase in Cu/SnAg3.0Cu0.5/Cu bridge interconnections under current stressing;Zhang;J. Appl. Phys.,2014

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Applications of Ni and Ag metallizations at the solder/Cu interfaces in advanced high-power automobile interconnects: An electromigration study;Surface and Coatings Technology;2024-05

2. Current-induced solder evolution and mechanical property of Sn-3.0Ag-0.5Cu solder joints under thermal shock condition;Journal of Alloys and Compounds;2024-01

3. Revealing evolutions of intermetallics in a solder joint under electromigration: A quasi-in situ study combining 3D microstructural characterization and numerical simulation;Applied Physics Letters;2023-12-04

4. A case study of intermetallic evolutions in a solder joint under electromigration using a novel experiment-simulation combined approach;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

5. Significant enhancement of comprehensive properties of SnBi solder through the addition of Cu@Ag core-shell particles;Materials Science and Engineering: A;2023-08

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