Cathodic peeling damage of Cu6Sn5 phase in Cu/SnAg3.0Cu0.5/Cu bridge interconnections under current stressing-Reference-Cited by-同舟云学术

Cathodic peeling damage of Cu6Sn5 phase in Cu/SnAg3.0Cu0.5/Cu bridge interconnections under current stressing

Published:2014-08-07 Issue:5 Volume:116 Page:054909
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Zhang Z. H.¹,Cao H. J.¹,Li M. Y.¹,Wang Y.¹,Liu Z. Q.¹

Affiliation:

1. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology Shenzhen Graduate School, Shenzhen 518055, People's Republic of China

Funder

China Postdoctoral Science Foundation

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.4892365

Reference25 articles.

1. Current-induced weakening of Sn3.5Ag0.7Cu Pb-free solder joints

2. Electromigration in flip chip solder joints under extra high current density

3. Effects of solder dimension on the interfacial shear strength and fracture behaviors of Cu/Sn–3Cu/Cu joints

4. Abnormal accumulation of intermetallic compound at cathode in a SnAg3.0Cu0.5lap joint during electromigration

5. Electrorecrystallization of intermetallic compound in the Sn0.7Cu solder joint

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3. Effect of Electric Field on the Lubricating Performance of Ga‐Based Liquid Metal;Advanced Materials Interfaces;2019-04-16

4. Refinement of the β-Sn Grains in Ni-Doped Sn-3.0Ag-0.5Cu Solder Joints with Cu-Based and Ni-Based Substrates;Journal of Electronic Materials;2018-03-01

5. Electromigration-induced growth mode transition of anodic Cu6Sn5 grains in Cu|SnAg3.0Cu0.5|Cu lap-type interconnects;Journal of Alloys and Compounds;2017-05