Assessment of room-temperature short-term stress relaxation and strain relaxation with recovery in Sn-Bi lead-free solders solidified under rotating magnetic field
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference22 articles.
1. The effects of antimony additions on microstructures, thermal and mechanical properties of Sn-8Zn-3Bi alloys
2. Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloys
3. Reinforcement of graphene nanosheets on the microstructure and properties of Sn58Bi lead-free solder
4. Effect of In on microstructure, thermodynamic characteristic and mechanical properties of Sn–Bi based lead-free solder
5. Undercooling, Microstructures and Hardness of Sn-Rich Pb-Free Solders on Cu-xZn Alloy Under Bump Metallurgies
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1. Effects of TiC nanoparticle addition on microstructures and mechanical properties of Sn-58Bi solder joints;Materials Today Communications;2024-08
2. On the correlation between mechanical, optical, and magnetic properties of co-substituted Sn1-x-yZnxMyOz metal-oxide ceramics with M = Fe, Co, Ni, and Mn;Ceramics International;2024-05
3. Exceptional strength-ductility synergy of Ni and Co–Mg–La ferrite nanoparticles reinforced Sn-1Ag-0.5Cu matrix composite;Physica Scripta;2023-08-25
4. The effect of permanent magnet stirring on the corrosion resistance of Sn-2.0Ag-0.5Cu-2Zn solder alloys in NaCl solution;Materials Chemistry and Physics;2023-07
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