Effect of metal/ceramic nanoparticle-doped fluxes on the wettability between Sn–Ag–Cu solder and a Cu layer
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference14 articles.
1. Interfacial reactions between lead-free solders and common base materials
2. Advances in lead-free electronics soldering
3. Lead-free Solders in Microelectronics
4. Determination of reactive wetting properties of Sn, Sn–Cu, Sn–Ag, and Sn–Pb alloys using a wetting balance technique
5. Properties of lead-free solder alloys with rare earth element additions
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