Boron Nitride Nanotubes Modified on a Lead-Free Solder Alloy for Microelectromechanical Packaging-Reference-Cited by-同舟云学术

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Boron Nitride Nanotubes Modified on a Lead-Free Solder Alloy for Microelectromechanical Packaging

Published:2022-08-29 Issue:9 Volume:5 Page:13626-13636
ISSN:2574-0970
Container-title:ACS Applied Nano Materials
language:en
Short-container-title:ACS Appl. Nano Mater.

Author:

Sharma Bharat¹^ORCID,Kumar Mukesh²,Kumar Vinay³,Sharma Ashutosh⁴^ORCID

Affiliation:

1. Institute of Microstructure Technology, Karlsruhe Institute of Technology, Hermonn-von-Helmholtz-Platz 1, 76344Eggenstein-Leopoldshafen, Germany

2. Department of Physics, Faculty of Science, Shree Guru Gobind Singh Tricentenary University, Gurgaon, 122505Delhi-NCR, India

3. Department of Physics, COBS & H, CCS Haryana Agricultural University, Hisar, Haryana125004, India

4. Department of Materials Science and Engineering, 206-Worldcup-ro, Yeongtong-gu, Suwon16499, Gyeonggi-do, Republic of Korea

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsanm.2c03382

Reference70 articles.

1. A review of soft errors and the low α-solder bumping process in 3-D packaging technology

2. Comparison of hermetic sealing using SAC and SnPb solder for a MEMS pressure sensor

3. Quasi-in-situ observation on diffusion anisotropy dominated asymmetrical growth of Cu-Sn IMCs under temperature gradient

4. Lead-free Solders in Microelectronics

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