Effect of adding 0.3wt% Ni into the Sn–0.7wt%Cu solder
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference24 articles.
1. Morphology of interfacial reaction between lead-free solders and electroless Ni–P under bump metallization
2. Aging effects on fracture behavior of 63Sn37Pb eutectic solder during tensile tests under the SEM
3. Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn–Ag–Cu flip-chip solder interconnects
4. Characterisation of constitutive behaviour of SnAg, SnAgCu and SnPb solder in flip chip joints
5. Interfacial reaction between Sn-1Bi-5In-9Zn solder and Cu substrate
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1. Bi Dispersion Hardening in Sn-Bi Alloys by Solid-State Aging;JOM;2023-08-24
2. Real-time monitoring of soldering process in SAC composite solder paste: movement and interaction of dopant particles in solder paste;Journal of Materials Science: Materials in Electronics;2023-02
3. Cu-Ni-Sn Ternary Phase Diagram Evaluation;MSI Eureka;2022-04-27
4. On the advantages of Bi addition into Sn-Cu-S lead-free solder;Materials Science and Technology;2021-12-12
5. Investigation of FeCoNiCu properties: Thermal stability, corrosion behavior, wettability with Sn-3.0Ag-0.5Cu and interlayer formation of multi-element intermetallic compound;Applied Surface Science;2021-04
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