Thermodynamic description of the binary Au–Sb and ternary Au–In–Sb systems
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference33 articles.
1. Lead-free solders, Materials Reliability for Electronics,2012
2. Phase Equilibria of the Sn-Sb-Ag Ternary System (I): Experimental
3. Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn–Ag solder and Au/electroless Ni(P)/Cu bond pad
4. Thermodynamic investigation of the solid and liquid AuSb alloys
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