Impact of permanent magnet stirring on dendrite growth and elastic properties of Sn–Bi alloys revealed by pulse echo overlap method
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference39 articles.
1. Influence of dual ceramic nanomaterials on the solderability and interfacial reactions between lead-free Sn-Ag-Cu and a Cu conductor
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3. Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints
4. Early stages of localized recrystallization in Pb-free BGA solder joints subjected to thermomechanical stress
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1. Dendrite Fragmentation Behavior and Mechanism during the Solidification of GH4742 Superalloy under Permanent Magnetic Stirring;Metals and Materials International;2024-07-23
2. The effect of permanent magnet stirring on the corrosion resistance of Sn-2.0Ag-0.5Cu-2Zn solder alloys in NaCl solution;Materials Chemistry and Physics;2023-07
3. Optimization of creep and thermal features of the Sn-Ag-Cu-Zn alloy by the magnetic field;Microelectronics Reliability;2023-04
4. The dynamic and static mechanical characteristics of Sn-7Zn-based solder alloy modified with microalloying of In, Fe and Co elements;Journal of Materials Science: Materials in Electronics;2022-11-01
5. Impact of rotating magnetic field on the microstructure, thermal properties, and creep behavior during the solidification of Sn–2.0Ag–0.5Cu solder alloy;Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications;2022-07-06
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